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TLD5045EJ датащи(PDF) 9 Page - Infineon Technologies AG |
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TLD5045EJ датащи(HTML) 9 Page - Infineon Technologies AG |
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9 / 30 page ![]() Data Sheet 9 Revision1.0 2015-05-28 Infineon® LITIX™ Power TLD5045EJ General Product Characteristics 4.3 Thermal Resistance Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go to www.jedec.org. Table 4-3 Thermal Resistance Parameter Symbol Values Unit Note or Test Condition Number Min. Typ. Max. Voltages Junction to Case RthJ-case 10 K/W 1)2) 1) Not subject to production test, specified by design. 2) Specified R thJ-case value is simulated at natural convection on a cold plate setup (all pins and the exposed Pad are fixed to ambient temperature). Ta=25°C, Power Switch and freewheeling diode are dissipating 1W. P_4.3.1 Junction to Ambient (2s2p) RthJA 40 K/W 1)3) 3) Specified RthJA value is according to Jedec JESD51-2,-7 at natural convection on FR4 2s2p board; The Product (Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu). According to JESD51-5 a thermal via array under the exposed pad contacted the first inner copper layer. Ta=25°C, Power Switch and freewheeling diode are dissipating 1W. P_4.3.2 |
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