TPL0102_15 datasheet(4/45 Pages) TI

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TPL0102

SLIS134C – MARCH 2011 – REVISED SEPTEMBER 2015

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7 Specifications

7.1 Absolute Maximum Ratings

(1) (2) (3)

MIN

MAX

UNIT

VDD to GND

–0.3

VSS to GND

Supply voltage

–7

0.3

VDD to VSS

VH, VL, VW

Voltage at resistor terminals

VSS – 0.3

VDD + 0.3

Digital input voltage

–0.3

VDD + 0.3

Pulse current

±20

IH, IL, IW

Continuous current

±2

Tstg

Storage temperature

-65

150

°C

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

(2)

The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.

(3)

All voltages are with respect to ground, unless otherwise specified.

7.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V(ESD)

Electrostatic discharge

Charged-device model (CDM), per JEDEC specification JESD22-

±1000

C101(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible with the necessary precautions.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Single supply operation (VSS = 0 V)

2.7

5.5

VDD

Dual supply operation (VSS = –VDD)

2.25

2.75

VH, VL

Terminal voltage range

VSS

VDD

VIH

Digital input voltage high (SCL, SDA, A0, A1, A2)

0.7 × VDD

5.5

VIL

Digital input voltage low (SCL, SDA, A0, A1, A2)

0.3 × VDD

Wiper current

±2

Ambient temperature

–40

°C

7.4 Thermal Information

TPL0102

THERMAL METRIC (1)

PW (TSSOP)

RUC (X2QFN)

UNIT

14 PINS

RθJA

Junction-to-ambient thermal resistance

112.9

119.4

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

39.9

51.3

°C/W

RθJB

Junction-to-board thermal resistance

55.9

59.0

°C/W

ψJT

Junction-to-top characterization parameter

3.5

1.2

°C/W

ψJB

Junction-to-board characterization parameter

55.2

59.0

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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