Absolute Maximum Ratings

Parameter

Units

ID @ VGS = 10V, TC = 25°C

Continuous Drain Current

6.7

ID @ VGS = 10V, TC = 100°C

Continuous Drain Current

4.2

IDM

Pulsed Drain Current ➀

27

PD @ TC = 25°C

Max. Power Dissipation

1 4

W

Linear Derating Factor

0.11

W/°C

VGS

Gate-to-Source Voltage

±20

V

EAS

Single Pulse Avalanche Energy ➁

110

mJ

IAR

Avalanche Current ➀

-A

EAR

Repetitive Avalanche Energy ➀

-mJ

dv/dt

Peak Diode Recovery dv/dt ➂

5.5

V/ns

T J

Operating Junction

-55 to 150

TSTG

Storage Temperature Range

Pckg. Mounting Surface Temp.

300 (for 5 S)

Weight

0.42(typical)

g

PD - 93982

The leadless chip carrier (LCC) package represents the

logical next step in the continual evolution of surface

mount technology. Desinged to be a close replacement

for the TO-39 package, the LCC will give designers the

extra flexibility they need to increase circuit board den-

sity. International Rectifier has engineered the LCC pack-

age to meet the specific needs of the power market by

increasing the size of the bottom source pad, thereby

enhancing the thermal and electrical performance. The

lid of the package is grounded to the source to reduce

RF interference.

A

REPETITIVEAVALANCHEANDdv/dtRATED

IRFE024

HEXFET

60V, N-CHANNEL

SURFACE MOUNT (LCC-18)

1/16/01

www.irf.com

1

LCC-18

Product Summary

Part Number

IRFE024

60V

0.15

Ω

6.7A

Features:

!

Surface Mount

!

Small Footprint

!

Alternative to TO-39 Package

!

Hermetically Sealed

!

Dynamic dv/dt Rating

!

Avalanche Energy Rating

!

Simple Drive Requirements

!

Light Weight

For footnotes refer to the last page