33

IR3838MPbF

Rev 1.41

Solder Resist

It is recommended that the lead lands are Non Solder Mask Defined (NSMD). The solder resist should

be pulled away from the metal lead lands by a minimum of 0.025mm to ensure NSMD pads.

The land pad should be Solder Mask Defined (SMD), with a minimum overlap of the solder resist onto

the copper of 0.05mm to accommodate solder resist mis-alignment.

Ensure that the solder resist in between the lead lands and the pad land is

≥ 0.15mm due to the high

aspect ratio of the solder resist strip separating the lead lands from the pad land.