1A/2.7A, 1MHz, Step-Down Regulators with

Synchronous Rectification and Internal Switches

2

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ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Input Voltage

3.0

5.5

V

°C

to +85

°C

2.500

2.525

2.550

FBSEL =

°C

to +85

°C

2.487

2.525

2.563

°C

to +85

°C

1.500

1.515

1.530

FBSEL =

unconnected

°C

to +85

°C

1.492

1.515

1.538

°C

to +85

°C

1.800

1.818

1.836

FBSEL =

REF

°C

to +85

°C

1.791

1.818

1.845

°C

to +85

°C

1.089

1.100

1.111

Preset Output Voltage

5.5V,

to 1A for

MAX1742,

to 2.5A for

MAX1842,

FBSEL =

GND

°C

to +85

°C

1.084

1.100

1.117

V

Adjustable Output Voltage

Range

FBSEL = GND

V

AC Load Regulation Error

2%

DC Load Regulation Error

0.4

%

Dropout Voltage

250

mV

°C to +85°C

1.089

1.100

1.111

Reference Voltage

°C to +85°C

1.084

1.100

1.117

V

Reference Load Regulation

0.5

2

mV

90

200

PMOS Switch

On-Resistance

110

250

70

150

NMOS Switch

On-Resistance

80

200

m

Ω

GND to PGND.....................................................................±0.3V

LX Current (Note 1).............................................................±4.7A

REF Short Circuit to GND Duration ............................Continuous

ESD Protection .....................................................................±2kV

SSOP (derate 16.7mW/°C above +70°C;

Operating Temperature Range ...........................-40°C to +85°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) ................................ +300°C

Note 1: LX has internal clamp diodes to PGND and IN. Applications that forward-bias these diodes should take care not to exceed

the IC’s package power dissipation limits.