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NCP500SQL50T1G датащи(PDF) 12 Page - ON Semiconductor |
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NCP500SQL50T1G датащи(HTML) 12 Page - ON Semiconductor |
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12 / 18 page ![]() NCP500, NCV500 www.onsemi.com 12 DEFINITIONS Load Regulation The change in output voltage for a change in output load current at a constant temperature. Dropout Voltage The input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 2% below its nominal. The junction temperature, load current, and minimum input supply requirements affect the dropout level. Output Noise Voltage This is the integrated value of the output noise over a specified frequency range. Input voltage and output load current are kept constant during the measurement. Results are expressed in mVRMS or nV Hz. Quiescent Current The current which flows through the ground pin when the regulator operates without a load on its output: internal IC operation, bias, etc. When the LDO becomes loaded, this term is called the Ground current. It is actually the difference between the input current (measured through the LDO input pin) and the output current. Line Regulation The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse technique such that the average chip temperature is not significantly affected. Line Transient Response Typical over and undershoot response when input voltage is excited with a given slope. Thermal Protection Internal thermal shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated at typically 160 °C, the regulator turns off. This feature is provided to prevent failures from accidental overheating. Maximum Package Power Dissipation The power dissipation level at which the junction temperature reaches its maximum operating value, i.e. 125 °C. APPLICATIONS INFORMATION The NCP500 series regulators are protected with internal thermal shutdown and internal current limit. A typical application circuit is shown in Figure 27. Input Decoupling (C1) A 1.0 mF capacitor either ceramic or tantalum is recommended and should be connected close to the NCP500 package. Higher values and lower ESR will improve the overall line transient response. Output Decoupling (C2) The NCP500 is a stable component and does not require a minimum Equivalent Series Resistance (ESR) or a minimum output current. The minimum decoupling value is 1.0 mF and can be augmented to fulfill stringent load transient requirements. The regulator accepts ceramic chip capacitors as well as tantalum devices. Larger values improve noise rejection and load regulation transient response. Figure 29 shows the stability region for a range of operating conditions and ESR values. Noise Decoupling The NCP500 is a low noise regulator without the need of an external bypass capacitor. It typically reaches a noise level of 50 mVRMS overall noise between 10 Hz and 100 kHz. The classical bypass capacitor impacts the start up phase of standard LDOs. However, thanks to its low noise architecture, the NCP500 operates without a bypass element and thus offers a typical 20 ms start up phase. Enable Operation The enable pin will turn on or off the regulator. These limits of threshold are covered in the electrical specification section of this data sheet. The turn−on/turn−off transient voltage being supplied to the enable pin should exceed a slew rate of 10 mV/ ms to ensure correct operation. If the enable is not to be used then the pin should be connected to Vin. Thermal As power across the NCP500 increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material, and the ambient temperature effect the rate of junction temperature rise for the part. This is stating that when the NCP500 has good thermal conductivity through the PCB, the junction temperature will be relatively low with high power dissipation applications. |
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