RF Micro Devices Inc.

7628 Thorndike Road, Greensboro, NC 27409-9421

DS140127

For sales or technical support, contact RFMD at +1.336.678.5570 or customerservice@rfmd.com.

The information in this publication is believed to be accurate. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents or other rights of

third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended

application circuitry and specifications at any time without prior notice.

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SDA-1000

Assembly Diagram

Measurement Technique

All specifications and typical performances reported in this document were measured in the following manner. Data was taken

using a temperature controlled probe station utilizing 150μm pitch GSG probes. The interface between the probes and integrated

circuit was made with a coplanar to microstrip ceramic test interface. The test interface was then wire bonded to the

die as shown in the figure below using 1mil diameter bondwires. The spacing between the test interface and the die was

200μm, and the bond wire loop height was 100μm. The thickness of the test interface is 125μm (5mil). The calibration of the

test fixture included the probes and test interfaces, so that the measurement reference plane was at the point of bond wire

attachment. Therefore, all data represents the integrated circuit and accompanying bond wires.