| поискавой системы для электроныых деталей |
|
SBB5000 датащи(PDF) 5 Page - RF Micro Devices |
|
|
|||||||||||||||||||||||||||||
SBB5000 датащи(HTML) 5 Page - RF Micro Devices |
|
5 / 6 page ![]() 5 of 6 DS111219 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. SBB5000 Notes: 1. All dimensions in inches [millimeters]. 2. Die thickness is 0.004 [0.100]. 3. Typical bond pad is 0.003x0.006 4. Backside metallization: Gold. 5. Bond pad metallization: Gold. 6. Backside is ground. Die Dimensions Pin Function Description RF IN This pad is DC coupled and matched to 50 . An external DC block is required. RF OUT This pad is DC coupled and matched to 50 . DC bias is applied through this pad. DIE BACKSIDE Die backside must be connected to RF/DC ground using silver filled conductive epoxy. |
|
|
ссылки URL |
| Вашему бизинису помогли Аллдатащит? [ DONATE ] |
Что такое Аллдатащит | реклама | контакт | Конфиденциальность | Ссылка на техническое описание | обмен ссыками | поиск по производителю All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |