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RFHA1028 датащи(PDF) 2 Page - RF Micro Devices |
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RFHA1028 датащи(HTML) 2 Page - RF Micro Devices |
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2 / 11 page ![]() RF Micro Devices Inc. 7628 Thorndike Road, Greensboro, NC 27409-9421 DS130923 For sales or technical support, contact RFMD at +1.336.678.5570 or customerservice@rfmd.com. The information in this publication is believed to be accurate. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents or other rights of third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended application circuitry and specifications at any time without prior notice. 2 of 11 RFHA1028 PRELIMINARY Absolute Maximum Ratings Parameter Rating Unit Drain Voltage Output Stage (VD2) 150 V Drain Voltage Input Stage (VD1) 100 V Gate Voltage (VG) -6 to 2 V Operating Voltage 45 V Ruggedness (VSWR) 10:1 Storage Temperature Range -55 to +125 °C Operating Temperature Range (TC) -40 to +85 °C Operating Junction Temperature (TJ) 250 °C Human Body Model Class 1A MTTF (TJ < 200°C, 95% Confidence Limits)* MTTF (TJ < 250°C, 95% Confidence Limits)* 3.0E + 06 1.4E + 05 Hours Thermal Resistance, RTH (Junction to Case) °C/W TC =85°C, DC Bias Only** RTH1 = 3.5, RTH2 = 1.1 TC =85°C, 1ms Pulse, 10% Duty Cycle TBD Caution! ESD sensitive device. RoHS (Restriction of Hazardous Substances): Compliant per EU Directive 2011/65/EU. Exceeding any one or a combination of the Absolute Maximum Rating conditions may cause permanent damage to the device. Extended application of Absolute Maximum Rating conditions to the device may reduce device reliability. Specified typical performance or functional operation of the device under Absolute Maximum Rating conditions is not implied. * MTTF – median time to failure for wear-out failure mode (30% I DSS degradation) which is determined by the technology process reliability. Refer to product qualification report for FIT(random) failure rate. Operation of this device beyond any one of these limits may cause permanent damage. For reliable continuous operation, the device voltage and current must not exceed the maximum operating values specified in the table above. Bias Conditions should also satisfy the following expression: PDISS < (TJ – TC) / RTH J-C and TC = TCASE ** Rth1 (driver stage) and Rth2 (output stage) – estimated Rth data Nominal Operating Parameters Parameter Specification Unit Condition Min Typ Max Recommended Operating Conditions Drain Voltage (VDSQ) 45 V Gate Voltage (VGSQ) -5 -3 -2 V Drain Bias Current 350 mA Stage 1 = 50mA, Stage 2 = 300mA Gate Current Input Stage (IG1) TBD Gate Current Output Stage (IG2) TBD Frequency of Operation 1200 1400 MHz DC Functional Test VGSQ Stage 1 -3.2 V VD = 45V, ID Stage 1 = 50mA VGSQ Stage 2 -3.2 V VD = 45V, ID Stage 2 = 300mA VDS(ON) – Stage 2 0.25 V VG = 0V, ID = 1.0A, Wafer level test |
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