RT8265

13

DS8265-02

March 2011

www.richtek.com

Information that is provided by Richtek Technology Corporation is believed to be accurate and reliable. Richtek reserves the right to make any change in circuit design,

specification or other related things if necessary without notice at any time. No third party intellectual property infringement of the applications should be guaranteed

by users when integrating Richtek products into any application. No legal responsibility for any said applications is assumed by Richtek.

Richtek Technology Corporation

Headquarter

5F, No. 20, Taiyuen Street, Chupei City

Hsinchu, Taiwan, R.O.C.

Tel: (8863)5526789 Fax: (8863)5526611

Richtek Technology Corporation

Taipei Office (Marketing)

5F, No. 95, Minchiuan Road, Hsintien City

Taipei County, Taiwan, R.O.C.

Tel: (8862)86672399 Fax: (8862)86672377

Email: marketing@richtek.com

Outline Dimension

A

B

J

F

H

M

C

D

I

Y

X

EXPOSED THERMAL PAD

(Bottom of Package)

8-Lead SOP (Exposed Pad) Plastic Package

Dimensions In Millimeters

Dimensions In Inches

Symbol

Min

Max

Min

Max

A

4.801

5.004

0.189

0.197

B

3.810

4.000

0.150

0.157

C

1.346

1.753

0.053

0.069

D

0.330

0.510

0.013

0.020

F

1.194

1.346

0.047

0.053

H

0.170

0.254

0.007

0.010

I

0.000

0.152

0.000

0.006

J

5.791

6.200

0.228

0.244

M

0.406

1.270

0.016

0.050

X

2.000

2.300

0.079

0.091

Option 1

Y

2.000

2.300

0.079

0.091

X

2.100

2.500

0.083

0.098

Option 2

Y

3.000

3.500

0.118

0.138