LTP5902-IPR_15 datasheet(29/32 Pages) LINER

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LTP5901-IPR/LTP5902-IPR

59012iprf

For more information www.linear.com/LTP5901-IPR or www.linear.com/LTP5902-IPR

REGULATORY AND STANDARDS COMPLIANCE

Radio Certification

The LTP5901 and LTP5902 have been certified under a

single modular certification, with the module name of

ETERNA2.Followingtheregulatoryrequirementsprovided

in the ETERNA2 Users Guide can enable customers to

ship products in the supported geographies, by simply

completing an unintentional radiator scan of the finished

product(s). The ETERNA2 Users Guide also provides the

technical information needed to enable customers to fur-

ther certify either the modules or products based upon the

modules in geographies that have not or do not support

modular certification.

Compliance to Restriction of Hazardous Substances

(RoHS)

Restriction of hazardous substances 2(RoHS 2) is a

directive that places maximum concentration limits on

the use of certain hazardous substances in electrical and

electronic equipment. Linear Technology is committed to

meeting the requirements of the European Community

directive 2011/65/EU.

This product has been specifically designed to utilize

RoHS-compliant materials and to eliminate or reduce the

use of restricted materials to comply with 2011/65/EU.

applicaTions inFormaTion

The RoHS-compliant design features include:

• RoHS-compliant solder for solder joints

• RoHS-compliant base metal alloys

• RoHS-compliant precious metal plating

• RoHS-compliant cable assemblies and connector

choices

• Halogen-free mold compound

• RoHS-compliant and 245°C re-flow compatible

Note: Customers may elect to use certain types of lead-

free solder alloys in accordance with the European Com-

munity directive 2011/65/EU. Depending on the type of

solder paste chosen, a corresponding process change to

optimize reflow temperatures may be required.

SOLDERING INFORMATION

The LTP5901 and LTP5902 are suitable for both eutectic

PbSn and RoHS-6 reflow. The maximum reflow solder-

ing temperature is 260°C. A more detailed description of

layoutrecommendations,assemblyproceduresanddesign

considerations is included in the LTP5901 and LTP5902

Hardware Integration Guide.

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