Part Description

Specifications subject to change without notice.

n North America: Tel. (800) 366-2266

n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298

n Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020

5

3.6 V, 450 mW DECT RF Power Amplifier IC

MA02203AD

V 1.0

Application Schematic

C2

C1

L2

60mil GETEK Board

L1

N/C

N/C

1

2

3

5

6

8

16

9

11

12

14

15

7

10

4

13

N/C

N/C

List of components:

C1 = C2 = 100 pF DLI multilayer ceramic chip capacitor (C11AH101K5TXL)

L1 = 8.2 nH Coilcraft chip inductor (1008CT.080XKBB)

L2 = 27 nH Coilcraft chip inductor (1008CS.270XKBB)

SOIC-16 Narrow Body Package

Dimensions in

millimeters

Dimensions in inches

Symbol

Min

Nom

Max

Min

Nom

Max

A

1.35

1.60

1.75

0.053

0.063

0.068

A1

0.10

0.25

0.004

0.010

A2

1.45

0.057

B

0.33

0.41

0.51

0.013

0.016

0.020

C

0.19

0.20

0.25

0.0075

0.008

0.0098

D

9.80

9.91

10.01

0.386

0.390

0.394

E

3.80

3.91

4.00

0.150

0.154

0.157

e

1.27

0.050

H

5.79

5.99

6.20

0.228

0.236

0.244

L

0.38

0.71

1.27

0.015

0.028

0.050

y

0.10

0.004

θ

0°

8°

0°

8°

NOTES:

1.

Controlling dimension: inch

2.

Lead frame material: copper alloy C151

3.

Lead thickness after solder plating will be 0.013" maximum

4.

Dimension “D” does not include mold flash, protrusions or gate

burrs

5.

Dimension “E” does not include interlead flash or protrusions

6.

Tolerance: ±0.010" unless otherwise specified