15

LTC1410

S

APPLICATI

I FOR ATIO

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

RD = CONVST

BUSY

1410 F18

DATA (N – 1)

DB11 TO DB0

DATA

DATA N

DB11 TO DB0

Figure 18. ROM Mode Timing

RD = CONVST

BUSY

1410 F17

DATA (N – 1)

DB11 TO DB0

DATA

DATA N

DB11 TO DB0

DATA (N + 1)

DB11-DB0

DATA N

DB11 TO DB0

Figure 17. Slow Memory Mode Timing

PACKAGE DESCRIPTIO

Dimensions in inches (millimeters) unless otherwise noted.

G28 SSOP 0694

0.005 – 0.009

(0.13 – 0.22)

0

° – 8°

0.022 – 0.037

(0.55 – 0.95)

0.205 – 0.212**

(5.20 – 5.38)

0.301 – 0.311

(7.65 – 7.90)

12 3

4

5

6 7 8

9 10 11 12

14

13

0.397 – 0.407*

(10.07 – 10.33)

25

26

22 21 20 19 18 17 16 15

23

24

27

28

0.068 – 0.078

(1.73 – 1.99)

0.002 – 0.008

(0.05 – 0.21)

0.0256

(0.65)

BSC

0.010 – 0.015

(0.25 – 0.38)

DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH

SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE

DIMENSIONS DO NOT INCLUDE INTERLEAD FLASH. INTERLEAD

FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE

*

**

G Package

28-Lead Plastic SSOP (0.209)

(LTC DWG # 05-08-1640)