4

LTC1347

TEMPERATURE (°C)

0

60

20

16

14

12

10

8

6

4

2

0

1347 G04

20

70

10

30

40

50

3 DRIVERS LOADED

1 DRIVER LOADED

TEMPERATURE (°C)

–40

0

4

8

10

12

40

20

1347 G06

6

080

14

16

18

–20

60

20

100

+

–

Driver Short-Circuit Current

TEMPERATURE (°C)

0

60

45

40

35

30

25

20

15

10

5

0

1347 G05

20

70

10

30

40

50

Driver Leakage in Shutdown

Receiver Short-Circuit Current

TEMPERATURE (°C)

–40

10

30

60

0

40

60

1347 G07

20

50

40

–20

20

80

100

–

+

Driver Output Waveforms

Receiver Output Waveforms

DRIVER

OUTPUT

1347 G08

1347 G09

RECEIVER

OUTPUT

INPUT

DRIVER

OUTPUT

INPUT

PI FU CTIO S

in the Shutdown mode. This pin should be decoupled with

a 0.1

µF ceramic capacitor.

GND: Ground Pin.

ON/OFF: TTL/CMOS Compatible Shutdown Pin. A logic

low puts the device in the shutdown mode with all receiv-

ers kept alive, and the supply current is 80

µA. All driver

outputs are in high impedance state. This pin cannot float.

= 0.1

µF for charge storage. The capacitor may be tied to

may be paralleled into common capacitors. For large

numbers of devices, increasing the size of the shared

common storage capacitors is recommended to reduce

ripple.

capacitor C = 0.1

µF for charge storage.