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LT1776CS8 датащи(PDF) 12 Page - Linear Technology |
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LT1776CS8 датащи(HTML) 12 Page - Linear Technology |
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12 / 20 page ![]() 12 LT1776 APPLICATIONS INFORMATION PAC = 1/2 • VIN • IOUT • (tr + tf + 30ns) • f tr = (VIN/1.6)ns in high dV/dt mode (VIN/0.16)ns in low dV/dt mode tf = (VIN/1.6)ns (irrespective of dV/dt mode) f = switching frequency Total power dissipation of the die is simply the sum of quiescent, DC and AC losses previously calculated. PD(TOTAL) = PQ + PDC + PAC Frequency Compensation Loop frequency compensation is performed by connect- ing a capacitor, or in most cases a series RC, from the output of the error amplifier (VC pin) to ground. Proper loop compensation may be obtained by empirical meth- ods as described in detail in Application Note 19. Briefly, this involves applying a load transient and observing the dynamic response over the expected range of VIN and ILOAD values. As a practical matter, a second small capacitor, directly from the VC pin to ground is generally recommended to attenuate capacitive coupling from the VSW pin. A typical value for this capacitor is 100pF. (See Switch Node Con- siderations). Switch Node Considerations For maximum efficiency, switch rise and fall times are made as short as practical. To prevent radiation and high frequency resonance problems, proper layout of the com- ponents connected to the IC is essential, especially the power path. B field (magnetic) radiation is minimized by keeping output diode, switch pin and input bypass capaci- tor leads as short as possible. E field radiation is kept low by minimizing the length and area of all traces connected to the switch pin (VSW). A ground plane should always be used under the switcher circuitry to prevent interplane coupling. However, remember that oscillator slowdown to achieve short-circuit protection (discussed above) is dependent on FB pin behavior, and this in turn, is sensitive to FB node external impedance. Figure 2 shows the typical relation- ship between FB divider Thevenin voltage and impedance, and oscillator frequency. This shows that as feedback network impedance increases beyond 10k, complete os- cillator slowdown is not achieved, and short-circuit pro- tection may be compromised. And as a practical matter, the product of FB pin bias current and larger FB network impedances will cause increasing output voltage error. (Nominal cancellation for 10k of FB Thevenin impedance is included internally.) Thermal Considerations Care should be taken to ensure that the worst-case input voltage and load current conditions do not cause exces- sive die temperatures. The packages are rated at 110 °C/W for the 8-pin SO (S8) and 130 °C/W for 8-pin PDIP (N8). Quiescent power is given by: PQ = IIN • VIN + IVCC • VOUT (This assumes that the VCC pin is connected to VOUT.) Power loss internal to the LT1776 related to actual output current is composed of both DC and AC switching losses. These can be roughly estimated as follows: DC switching losses are dominated by output switch “ON voltage”, i.e., PDC = VON • IOUT • DC VON = Output switch ON voltage, typically 1V at 500mA IOUT = Output current DC = ON duty cycle AC switching losses are typically dominated by power lost due to the finite rise time and fall time at the VSW node. Assuming, for simplicity, a linear ramp up of both voltage and current and a current rise/fall time equal to 15ns, |
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