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THBTGFR421 датащи(PDF) 12 Page - Seoul Semiconductor |
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THBTGFR421 датащи(HTML) 12 Page - Seoul Semiconductor |
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12 / 13 page ![]() 서식번호 : SSC- QP- 7- 07- 25 (Rev.0.0) Rev. 02 Rev. 02 January 2012 January 2012 WWW.SEOULSEMICON.COM WWW.SEOULSEMICON.COM 10 sec. Max. Soldering time Condition 240 ℃ ℃ ℃ ℃ Max. Peak-Temperature 120 sec. Max. Pre-heat time 120~150 ℃ ℃ ℃ ℃ Pre-heat Lead Solder 10 sec. Max. Soldering time Condition 260 ℃ ℃ ℃ ℃ Max. Peak-Temperature 120 sec. Max. Pre-heat time 150~200 ℃ ℃ ℃ ℃ Pre-heat Lead Free Solder Lead Solder 2.5~5 C / sec. o o o Pre-heating 120~150 C 120sec. Max. 60sec. Max. Above 200 C o 240 C Max. 10 sec. Max. 2.5~5 C / sec. 260 C Max. 10 sec. Max. o 60sec. Max. Above 220 C 120sec. Max. Pre-heating 150~200 C 1~5 C / sec. o o o o 1~5 C / sec. Lead-frame Solder (1) Lead Solder (2) Lead-Free Solder (3) Hand Soldering conditions Do not exceed 3 seconds at maximum 280ºC under soldering iron. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products. 11. Soldering profile |
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