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LTC4075 датащи(PDF) 13 Page - Linear Technology |
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LTC4075 датащи(HTML) 13 Page - Linear Technology |
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13 / 16 page ![]() LTC4075/LTC4075X 13 4075Xfa PD is the power dissipated, VIN is the input supply volt- age (either DCIN or USBIN), VBAT is the battery voltage and IBAT is the charge current. The approximate ambient temperature at which the thermal feedback begins to protect the IC is: TA = 105°C – PD • θJA TA = 105°C – (VIN – VBAT) • IBAT • θJA Example: An LTC4075 operating from a 5V wall adapter (on the DCIN input) is programmed to supply 800mA full-scale current to a discharged Li-Ion battery with a voltage of 3.3V. Assuming θJA is 40°C/W (see Thermal Considerations), the ambient temperature at which the LTC4075 will begin to reduce the charge current is approximately: TA = 105°C – (5V – 3.3V) • (800mA) • 40°C/W TA = 105°C – 1.36W • 40°C/W = 105°C – 54.4°C TA = 50.6°C The LTC4075 can be used above 50.6°C ambient, but the charge current will be reduced from 800mA. The ap- proximate current at a given ambient temperature can be approximated by: I CT VV BAT A IN BAT JA = ° 105 – (– • ) θ Using the previous example with an ambient temperature of 60°C, the charge current will be reduced to approxi- mately: I CC VV C W C CA ImA BAT BAT = °° ° = ° ° = 105 60 53 3 40 45 68 662 – (– . )• / / It is important to remember that LTC4075 applications do not need to be designed for worst-case thermal conditions, since the IC will automatically reduce power dissipation when the junction temperature reaches approximately 105°C. Thermal Considerations In order to deliver maximum charge current under all conditions, it is critical that the exposed metal pad on the backside of the LTC4075 package is properly soldered to the PC board ground. When correctly soldered to a 2500mm2 double sided 1oz copper board, the LTC4075 has a thermal resistance of approximately 40°C/W. Failure to make thermal contact between the exposed pad on the backside of the package and the copper board will result in thermal resistances far greater than 40°C/W. As an example, a correctly soldered LTC4075 can deliver over 800mA to a battery from a 5V supply at room temperature. Without a good backside thermal connection, this number would drop to much less than 500mA. Protecting the USB Pin and Wall Adapter Input from Overvoltage Transients Caution must be exercised when using ceramic capacitors to bypass the USBIN pin or the wall adapter inputs. High voltage transients can be generated when the USB or wall adapter is hot plugged. When power is supplied via the USB bus or wall adapter, the cable inductance along with the self resonant and high Q characteristics of ceramic capacitors can cause substantial ringing which could exceed the maximum voltage pin ratings and damage the LTC4075. Refer to Linear Technology Application Note 88, entitled “Ceramic Input Capacitors Can Cause Overvoltage Transients” for a detailed discussion of this problem. The long cable lengths of most wall adapters and USB cables APPLICATIO S I FOR ATIO |
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