Data Sheet S14074EJ1V0DS

19

µµµµPD16315

13. RECOMMENDED SOLDERING CONDITIONS

The following conditions must be met for soldering conditions of the

µ PD16315.

For more details, refer to the Semiconductor Device Mounting Technology Manual (C10535E).

Please consult with our sales offices in case other soldering process is used, or in case the soldering is done under

different conditions.

Type of Surface Mount Device

µ PD16315GB-3BS : 44-pin plastic QFP (10 x 10)

Soldering process

Soldering conditions

Symbol

Infrared ray reflow

Peak package’s surface temperature: 235

°C or below,

Reflow time: 30 seconds or below (210

°C or higher),

Number of reflow process: MAX.3

IR35-00-3

VPS

Peak package’s temperature: 215

°C or below,

Reflow time: 25 to 40 seconds (200

°C or higher),

Number of reflow process: MAX.3

VP15-00-3

Wave Soldering

Solder temperature: 260

°C or below,

Flow time: 10 seconds or below

Temperature of pre-heat: 120

°C pr below (Plastic surface

temperature)

Number of flow process: 1

WS60-00-1

Partial heating method

Terminal temperature: 300

°C or below,

Time 3 seconds or below (per side of pin position)

−

Caution Do not apply more than a single process at once, except for partial heating method.