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AN3216 датащи(PDF) 25 Page - STMicroelectronics

номер детали AN3216
подробное описание детали  Getting started with STM32L1xxx hardware development
PDF  33 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
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AN3216 датащи(HTML) 25 Page - STMicroelectronics

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DocID17496 Rev 7
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AN3216
Recommendations
32
6
Recommendations
6.1
Printed circuit board
For technical reasons, it is best to use a multilayer printed circuit board (PCB) with a
separate layer dedicated to ground (VSS) and another dedicated to the VDD supply. This
provides good decoupling and a good shielding effect. For many applications, economical
reasons prohibit the use of this type of board. In this case, the major requirement is to
ensure a good structure for ground and for the power supply.
6.2
Component position
A preliminary layout of the PCB must make separate circuits:
High-current circuits
Low-voltage circuits
Digital component circuits
Circuits separated according to their EMI contribution. This will reduce cross-coupling
on the PCB that introduces noise.
6.3
Ground and power supply (VSS, VDD, VSSA, VDDA)
Every block (noisy, low-level sensitive, digital, etc.) should be grounded individually, and all
ground returns should be to a single point. Loops must be avoided or have a minimum area.
In order to improve analog performance, you must use separate supply sources for VDD and
VDDA, and place the decoupling capacitors as close as possible to the device. The power
supplies should be implemented close to the ground line to minimize the area of the
supplies loop. This is due to the fact that the supply loop acts as an antenna, and acts as the
main transmitter and receiver of EMI. All component-free PCB areas must be filled with
additional grounding to create a kind of shielding (especially when using single-layer PCBs).
6.4
Decoupling
All power supply and ground pins must be properly connected to the power supplies. These
connections, including pads, tracks and vias should have as low an impedance as possible.
This is typically achieved with thick track widths and, preferably, the use of dedicated power
supply planes in multilayer PCBs.
In addition, each power supply pair should be decoupled with filtering ceramic capacitors C
(100 nF) and a Tantalum or Ceramic capacitor C of about 10 µF connected in parallel on the
STM32L1xxx device. These capacitors need to be placed as close as possible to, or below,
the appropriate pins on the underside of the PCB. Typical values are 10 nF to 100 nF, but
exact values depend on the application needs. Figure 15 shows the typical layout of such a
VDD/VSS pair.



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