26

µPD6P4B

Data Sheet U13594EJ2V0DS00

8. RECOMMENDED SOLDERING CONDITIONS

Carry out the soldered packaging of this product under the following recommended conditions.

For details of the soldering conditions, refer to information material Semiconductor Device Mounting

Technology Manual (C10535E).

For soldering methods and conditions other than the recommended conditions, please consult one of our NEC

sales representatives.

Table 8-1. Soldering Conditions for Surface-Mount Type

(1)

µPD6P4BGS-×××: 20-pin plastic SOP (300 mil)

Soldering Method

Soldering Condition

Recommended

Condition Symbol

Infrared reflow

Package peak temperature: 235

°C, Time: 30 secs. max. (210 °C min.),

IR35-00-2

Number of times: Twice max.

VPS

Package peak temperature: 215

°C, Time: 40 secs. max. (200 °C min.),

VP15-00-2

Number of times: Twice max.

Wave soldering

Solder bath temperature: 260

°C max., Time: 10 secs. max., Number of times: once, WS60-00-1

Preheating temperature: 120

°C max. (package surface temperature.)

Partial heating

Pin temperature: 300

°C or less ; time: 3 secs or less (for each side of the device)

—

Caution Do not use two or more soldering methods in combination (except partial heating).

(2)

µPD6P4BMC-5A4: 20-pin plastic SSOP (300 mil)

Soldering Method

Soldering Condition

Recommended

Condition Symbol

Infrared reflow

Package peak temperature: 235

°C, Time: 30 secs. max. (210 °C min.),

IR35-00-3

Number of times: Three times max.

VPS

Package peak temperature: 215

°C, Time: 40 secs. max. (200 °C min.),

VP15-00-3

Number of times: Three times max.

Wave soldering

Solder bath temperature: 260

°C max., Time: 10 secs. max., Number of times: once, WS60-00-1

Preheating temperature: 120

°C max. (package surface temperature.)

Partial heating

Pin temperature: 300

°C or less ; time: 3 secs or less (for each side of the device)

—

Caution Do not use two or more soldering methods in combination (except partial heating).