Parameters

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ΔV

Dynamic breakover voltage

For a DIAC, this is the dynamic variation of its voltage at triggering. It is the

difference between VBO and the voltage for a 10mA current.

DIACs feature a negative-resistance triggered characteristic.

Junction to ambient thermal resistance

This is the thermal resistance between junction and ambient, when the device is

used without heatsink. For SMD packages, the copper surface under the tab is

specified.

Junction to case thermal resistance

This is the thermal resistance between junction to case. For TRIACs and SCRs,

this value is respectively specified for AC and DC operations.

Junction to lead thermal resistance

This is the thermal resistance between junction and leads. It is given for small

packages like TO92, with no other metallic case temperature reference.

Transient thermal impedance

This is the value of the thermal resistance when the steady state of the device is

relative value of this impedance according the to the time duration of dissipated

power pulse.

Table 2.

Electrical characteristics parameters (continued)

Parameter

Name and description