MSS1P3, MSS1P4

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Vishay General Semiconductor

Revision: 17-Jan-14

3

Document Number: 89019

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Fig. 5 - Typical Junction Capacitance

Fig. 6 - Typical Transient Thermal Impedance

PACKAGE OUTLINE DIMENSIONS in inches (millimeters)

1000

100

10

0.1

1

10

100

Reverse Voltage (V)

1000

100

10

1

0.1

0.01

1

10

100

1000

t - Pulse Duration (s)

Junction to Ambient

0.106 (2.70)

0.091 (2.30)

0.055 (1.40)

0.047 (1.20)

Cathode Band

MicroSMP

0.030 (0.75)

0.022 (0.55)

0.030 (0.75)

0.022 (0.55)

0.059 (1.50)

0.043 (1.10)

0.039 (0.98)

0.031 (0.78)

0.091 (2.30)

0.083 (2.10)

0.020 (0.50)

0.043

(1.10)

0.011 (0.27)

0.005 (0.12)

0.079

(2.00)

0.032

(0.80)

0.032

(0.80)

Mounting Pad Layout

0.029 (0.73)

0.025 (0.63)