LT1236LS8

3

1236ls8f

PARAMETER

CONDITIONS

LT1236LS8-5

UNITS

MIN

TYP

MAX

Load Regulation (Sinking Current)

(Note 4)

l

60

100

150

ppm/mA

ppm/mA

Supply Current

l

0.8

1.2

1.5

mA

mA

Output Voltage Noise

(Note 5)

0.1Hz ≤ f ≤ 10Hz

10Hz ≤ f ≤ 1kHz

3.0

2.2

3.5

Long-Term Stability of Output Voltage (Note 6)

∆t = 1000Hrs Non-Cumulative

20

ppm

Temperature Hysteresis of Output (Note 7)

∆T = ±25°C

∆T = 0°C to 70°C

∆T = –40°C to 85°C

3

8

60

ppm

ppm

ppm

l

denotes the specifications which apply over the full operating

Note 1: Stresses beyond those listed under Absolute Maximum Ratings

may cause permanent damage to the device. Exposure to any Absolute

Maximum Rating condition for extended periods may affect device

reliability and lifetime.

Note 2: Output voltage is measured immediately after turn-on. Changes

due to chip warm-up are typically less than 0.005%.

Note 3: Temperature coefficient is measured by dividing the change in

output voltage over the temperature range by the change in temperature.

Incremental slope is also measured at 25°C.

Note 4: Line and load regulation are measured on a pulse basis. Output

changes due to die temperature change must be taken into account

separately.

Note 5: RMS noise is measured with a 2-pole highpass filter at 10Hz and a

2-pole lowpass filter at 1kHz. The resulting output is full-wave rectified and

then integrated for a fixed period, making the final reading an average as

opposed to RMS. Correction factors are used to convert from average to

RMS, and 0.88 is used to correct for the non-ideal bandbass of the filters.

Peak-to-peak noise is measured with a single highpass filter at 0.1Hz and a

2-pole lowpass filter at 10Hz. The unit is enclosed in a still-air environment

to eliminate thermocouple effects on the leads. Test time is 10 seconds.

Note 6: Long-term stability typically has a logarithmic characteristic and

therefore, changes after 1000 hours tend to be much smaller than before

that time. Total drift in the second thousand hours is normally less than

one third that of the first thousand hours, with a continuing trend toward

reduced drift with time. Significant improvement in long-term drift can

be realized by preconditioning the IC with a 100-200 hour, 125°C burn in.

Long term stability will also be affected by differential stresses between

the IC and the board material created during board assembly. Temperature

cycling and baking of completed boards is often used to reduce these

stresses in critical applications.

Note 7: Hysteresis in output voltage is created by package stress that

differs depending on whether the IC was previously at a higher or lower

temperature. Output voltage is always measured at 25°C, but the IC is

cycled to high or low temperature before successive measurements.

Hysteresis is roughly proportional to the square of temperature change.

Hysteresis is not normally a problem for operational temperature

excursions, but can be significant in critical narrow temperature range

applications where the instrument might be stored at high or low

temperatures. Hysteresis measurements are preconditioned by one

temperature cycle.