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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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AN4444 датащи(PDF) 53 Page - STMicroelectronics |
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AN4444 датащи(HTML) 53 Page - STMicroelectronics |
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53 / 68 page  DocID025925 Rev 2 53/68 AN4444 Design guidelines 68 10.2 Thermal impedance and power dissipation calculation The relationship between junction temperature (TJ) and power dissipation during transmission (PD) is described by the following formula: Equation 9 where TA is the ambient temperature (from -40 to +85 °C) and ZthJA is the junction to ambient thermal impedance of the ST7590 IC, which is related to the length of the transmission (tTX) and to the duty cycle d = tPKT / (tPKT + tIDLE), assuming a packet- fragmented transmission as illustrated by Figure 44. Figure 44. Packet-fragmented transmission When soldered to a proper dissipating area on the PCB as explained above, the ST7590 IC is characterized by a steady state thermal resistance RthJA of about 50 °C/W. The thermal impedance curve obtained as power dissipation step response is reported in Figure 45. ) , ( ) , ( d t Zth P T d t T TX JA D A TX J |
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