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AN4199 датащи(PDF) 19 Page - STMicroelectronics |
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AN4199 датащи(HTML) 19 Page - STMicroelectronics |
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19 / 23 page ![]() DocID023917 Rev 1 19/23 AN4199 Design guidelines for schematic and PCB layout 23 6.4.3 Ground plane and heatsink In order to dissipate the heat, a large ground plane is used. It is mandatory to have a large ground plane on the top and bottom layers and solder the slug on the PCB. Figure 22. Ground plane Large ground plane on the top side Large ground plane on the bottom side |
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