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HIP6021 датащи(PDF) 11 Page - Intersil Corporation |
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HIP6021 датащи(HTML) 11 Page - Intersil Corporation |
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11 / 15 page ![]() 2-306 Layout Considerations MOSFETs switch very fast and efficiently. The speed with which the current transitions from one device to another causes voltage spikes across the interconnecting impedances and parasitic circuit elements. The voltage spikes can degrade efficiency, radiate noise into the circuit, and lead to device over-voltage stress. Careful component layout and printed circuit design minimizes the voltage spikes in the converter. Consider, as an example, the turn- off transition of the upper PWM MOSFET. Prior to turn-off, the upper MOSFET was carrying the full load current. During the turn-off, current stops flowing in the upper MOSFET and is picked up by the lower MOSFET or Schottky diode. Any inductance in the switched current path generates a large voltage spike during the switching interval. Careful component selection, tight layout of the critical components, and short, wide circuit traces minimize the magnitude of voltage spikes. See the Application Note ANTBD for evaluation board drawings of the component placement and printed circuit board. There are two sets of critical components in a DC-DC converter using a HIP6020 controller. The switching power components are the most critical because they switch large amounts of energy, and as such, they tend to generate equally large amounts of noise. The critical small signal components are those connected to sensitive nodes or those supplying critical bypass current. The power components and the controller IC should be placed first. Locate the input capacitors, especially the high- frequency ceramic decoupling capacitors, close to the power switches. Locate the output inductor and output capacitors between the MOSFETs and the load. Locate the PWM controller close to the MOSFETs. The critical small signal components include the bypass capacitor for VCC and the soft-start capacitor, CSS. Locate these components close to their connecting pins on the control IC. Minimize any leakage current paths from SS node, since the internal current source is only 28 µA. A multi-layer printed circuit board is recommended. Figure 8shows the connections of the critical components in the converter. Note that the capacitors CIN and COUT each represent numerous physical capacitors. Dedicate one solid layer for a ground plane and make all critical component ground connections with vias to this layer. Dedicate another solid layer as a power plane and break this plane into smaller islands of common voltage levels. The power plane should support the input power and output power nodes. Use copper filled polygons on the top and bottom circuit layers for the PHASE nodes, but do not unnecessarily oversize these particular islands. Since the PHASE nodes are subjected to very high dV/dt voltages, the stray capacitor formed between these islands and the surrounding circuitry will tend to couple switching noise. Use the remaining printed circuit layers for small signal wiring. The wiring traces from the control IC to the MOSFET gate and source should be sized to carry 2A peak currents. PWM Controller Feedback Compensation The PWM controller uses voltage-mode control for output regulation. This section highlights the design consideration for a PWM voltage-mode controller. Apply the methods and considerations only to the PWM controller. Figure 9 highlights the voltage-mode control loop for a synchronous-rectified buck converter. The output voltage (VOUT) is regulated to the Reference voltage level. The reference voltage level is the DAC output voltage (DACOUT). The error amplifier (Error Amp) output (VE/A) is compared with the oscillator (OSC) triangular wave to provide a pulse- width modulated (PWM) wave with an amplitude of VIN at the PHASE node. The PWM wave is smoothed by the output filter (LO and CO). The modulator transfer function is the small-signal transfer function of VOUT/VE/A. This function is dominated by a DC Gain, given by VIN/VOSC, and shaped by the output filter, with a double pole break frequency at FLC and a zero at FESR. Modulator Break Frequency Equations The compensation network consists of the error amplifier (internal to the HIP6021) and the impedance networks ZIN and ZFB. The goal of the compensation network is to provide a closed loop transfer function with high 0dB crossing frequency (f0dB) and adequate phase margin. Phase margin is the difference between the closed loop phase at f0dB and 180 degrees. The equations below relate the compensation network’s poles, zeros and gain to the components (R1, R2, R3, C1, C2, and C3) in Figure 8. Use these guidelines for locating the poles and zeros of the compensation network: 1. Pick Gain (R2/R1) for desired converter bandwidth 2. Place 1ST Zero Below Filter’s Double Pole (~75% FLC) 3. Place 2ND Zero at Filter’s Double Pole 4. Place 1ST Pole at the ESR Zero 5. Place 2ND Pole at Half the Switching Frequency 6. Check Gain against Error Amplifier’s Open-Loop Gain 7. Estimate Phase Margin - Repeat if Necessary F LC 1 2 π L O C O × × ---------------------------------------- = F ESR 1 2 π ESR C O × × ----------------------------------------- = HIP6021 |
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