4-16

All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.

Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-

out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and

reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result

from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.

For information regarding Intersil Corporation and its products, see web site www.intersil.com

Sales Office Headquarters

NORTH AMERICA

Intersil Corporation

P. O. Box 883, Mail Stop 53-204

Melbourne, FL 32902

TEL: (321) 724-7000

FAX: (321) 724-7240

EUROPE

Intersil SA

Mercure Center

100, Rue de la Fusee

1130 Brussels, Belgium

TEL: (32) 2.724.2111

FAX: (32) 2.724.22.05

ASIA

Intersil Ltd.

8F-2, 96, Sec. 1, Chien-kuo North,

Taipei, Taiwan 104

Republic of China

TEL: 886-2-2515-8508

FAX: 886-2-2515-8369

HIP6020A

Small Outline Plastic Packages (SOIC)

NOTES:

1. Symbols are defined in the “MO Series Symbol List” in Section 2.2

of Publication Number 95.

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Dimension “D” does not include mold flash, protrusions or gate

burrs. Mold flash, protrusion and gate burrs shall not exceed

0.15mm (0.006 inch) per side.

4. Dimension “E” does not include interlead flash or protrusions. In-

terlead flash and protrusions shall not exceed 0.25mm (0.010

inch) per side.

5. The chamfer on the body is optional. If it is not present, a visual

index feature must be located within the crosshatched area.

6. “L” is the length of terminal for soldering to a substrate.

7. “N” is the number of terminal positions.

8. Terminal numbers are shown for reference only.

9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater

above the seating plane, shall not exceed a maximum value of

0.61mm (0.024 inch)

10. Controlling dimension: MILLIMETER. Converted inch dimen-

sions are not necessarily exact.

INDEX

AREA

E

D

N

12

3

-B-

0.25(0.010)

C A

M

BS

e

-A-

L

B

M

-C-

A1

A

SEATING PLANE

0.10(0.004)

C

H

0.25(0.010)

B

M

M

α

28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE

SYMBOL

INCHES

MILLIMETERS

NOTES

MIN

MAX

MIN

MAX

A

0.0926

0.1043

2.35

2.65

-

A1

0.0040

0.0118

0.10

0.30

-

B

0.013

0.0200

0.33

0.51

9

C

0.0091

0.0125

0.23

0.32

-

D

0.6969

0.7125

17.70

18.10

3

E

0.2914

0.2992

7.40

7.60

4

e

0.05 BSC

1.27 BSC

-

H

0.394

0.419

10.00

10.65

-

h

0.01

0.029

0.25

0.75

5

L

0.016

0.050

0.40

1.27

6

N28

28

7

α

-

Rev. 0 12/93