HIP4086AP datasheet(4/9 Pages) INTERSIL

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HIP4086

Absolute Maximum Ratings

Thermal Information

Supply Voltage, VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 16V

Logic I/O Voltages . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VDD +0.3V

Voltage on xHS . . . . . . . . . -6V (Transient) to 85V (-40oC to 150oC)

Voltage on xHB . . . . . . . . . . . . . . . . . . . . VxHS -0.3V to VxHS +VDD

Voltage on xLO . . . . . . . . . . . . . . . . . . . . . VSS -0.3V to VDD +0.3V

Voltage on xHO . . . . . . . . . . . . . . . . . . . . VxHS -0.3V to VxHB +0.3V

Phase Slew Rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20V/ns

Operating Conditions

Supply Voltage, VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . +7V to +15V

Voltage on xHB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VxHS + VDD

Voltage on xHS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to 80V

Ambient Temperature Range . . . . . . . . . . . . . . . . . . -40oC to 125oC

Junction Temperature Range . . . . . . . . . . . . . . . . . . -40oC to 150oC

Thermal Resistance (Typical, Note 1)

θJA (oC/W)

SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC

Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . .150oC

Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300oC

(SOIC - Lead Tips Only)

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operationofthe

device at these or any other conditions above those indicated in the operational sections of this speciﬁcation is not implied.

NOTES:

θJA is measured with the component mounted on an evaluation PC board in free air.

2. All voltages are relative to VSS unless otherwise specified.

3. x = A, B and C. For example, xHS refers to AHS, BHS and CHS.

Electrical Speciﬁcations

VDD = VxHB = 12V, VSS = VxHS = 0V, RDEL = 20K, RUV = ∞, Gate Capacitance (CGATE) = 1000pF

PARAMETER

TEST CONDITIONS

TJ = 25

TJ = -40

oC TO

150oC

UNITS

MIN

TYP

MAX

MIN

MAX

SUPPLY CURRENTS AND UNDER VOLTAGE PROTECTION

VDD Quiescent Current

xHI = 5V, xLI = 5V

2.7

3.4

4.2

2.1

4.3

VDD Operating Current

f = 20kHz, 50% Duty Cycle

6.3

8.25

10.5

xHB On Quiescent Current

xHI = 0V

100

µA

xHB Off Quiescent Current

xHI = VDD

0.6

0.8

1.3

0.5

1.4

xHB Operating Current

f = 20kHz, 50% Duty Cycle

0.7

0.9

1.3

2.0

Qpump Output Voltage

No Load

11.5

12.5

10.5

14.5

Qpump Output Current

VxHS = 12V, VxHB = 22V

100

130

140

µA

xHB, xHS Leakage Current

VxHS = 80V, VxHB = 93V

µA

VDD Rising Undervoltage Threshold

RUV open

6.2

7.1

8.0

6.1

8.1

VDD Falling Undervoltage Threshold

RUV open

5.75

6.6

7.5

5.6

7.6

Minimum Undervoltage Threshold

RUV = VDD

6.2

6.8

4.9

6.9

INPUT PINS: ALI, BLI, CLI, AHI, BHI, CHI, AND DIS

Low Level Input Voltage

1.0

0.8

High Level Input Voltage

2.5

2.7

Input Voltage Hysteresis

Low Level Input Current

VIN = 0V

100

135

140

µA

High Level Input Current

VIN = 5V

-1

-10

+10

µA

GATE DRIVER OUTPUT PINS: ALO, BLO, CLO, AHO, BHO, AND CHO

Low Level Output Voltage (VOUT - VSS)ISINKING = 30mA

100

200

Peak Turn-On Current

VOUT = 0V

0.3

0.5

0.7

1.0

Peak Turn-Off Current

VOUT = 12V

0.7

1.1

1.5

0.5

1.7

HIP4086

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