µPC1093

13

µPC1093T: Power mini mold (SOT-89)

Process

Conditions

Symbol

Infrared ray reflow

Peak temperature: 235

°C or below (Package surface temperature),

IR35-00-2

Reflow time: 30 seconds or less (at 210

°C or higher),

Maximum number of reflow processes: 2 times.

VPS

Peak temperature: 215

°C or below (Package surface temperature),

VP15-00-2

Reflow time: 40 seconds or less (at 200

°C or higher),

Maximum number of reflow processes: 2 times.

Wave soldering

Solder temperature: 260

°C or below, Flow time: 10 seconds or less,

WS60-00-1

Maximum number of flow processes: 1 time,

Pre-heating temperature: 120

°C or below (Package surface temperature).

Caution Apply only one kind of soldering condition to a device, or the device will be damaged by heat stress.

µPC1093TA: 5-pin plastic mini mold (SC-74A)

Process

Conditions

Symbol

Infrared ray reflow

Peak temperature: 235

°C or below (Package surface temperature),

IR35-00-3

Reflow time: 30 seconds or less (at 210

°C or higher),

Maximum number of reflow processes: 3 times.

VPS

Peak temperature: 215

°C or below (Package surface temperature),

VP15-00-3

Reflow time: 40 seconds or less (at 200

°C or higher),

Maximum number of reflow processes: 3 times.

Wave soldering

Solder temperature: 260

°C or below, Flow time: 10 seconds or less,

WS60-00-1

Maximum number of flow processes: 1 time,

Pre-heating temperature: 120

°C or below (Package surface temperature).

Caution Apply only one kind of soldering condition to a device, or the device will be damaged by heat stress.