INTEGRATED CIRCUITS INC.

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APR9301

http://www.aplusinc.com.tw

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10

VER2.3

7

Table 4 Analog Characteristics ( Note 1 )

Item

Symbol

Condition

Mim

Typ

Max

Unit

MicIn Input Voltage

VMI

--

--

--

20

mVp-p

MicIn Input Resistance

RMI

--

--

10

--

kΩ

MicIn Amp Gain (1)

GMIl

AGC≦2.2V

--

24

--

dB

MicIn Amp Gain (2)

GMI2

AGC≧3.OV

--

-45

-15

dB

AnaIn Input Voltage

VANI

--

--

--

50

mVp-p

AnaIn Input Resistance

RANI

--

--

10

--

kΩ

AnaIn Amp Gain

GANI

Analn to SP+/-

--

22

--

dB

AGC Output Resistance

RAGC

--

--

1

--

kΩ

SP+/- Output Power

Psp

Rsp+/- = 16Ω

--

12.2

--

mW

Voltage Amplitude Across SP+/-

Vsp

Rsp+/-≧16Ω

--

1.25

--

Vp-p

Total Harmonic Distortion

THD

@ 1kHz & 20mVp-p input

1

%

Note 1: Typical Values: VCCD = VCCA = 5V; VSSD = VSSA = 0V; TA = 25℃

Note 2: Except pins 23 and 27 which have internal pull-up resistors.

Bonding Pad Diagram & Description of Bonding Pad Coordinates :

Figure 5 APR9301 Die Bonding Pad Diagram

Notes:

Die diagram is with

respect to die center(um)

Die Dimensions:

X=214± 1 mils(5500um)

Y=144± 1 mils(3750um)

Die Thickness:

13.8± 1.0 mils

(350± 25um)

Pad Opening:

4.3mils

110um

to Ground.