10-16

Die Characteristics

DIE DIMENSIONS:

121 mils x 123 mils (3073micrms x 3124micrms)

METALLIZATION:

Type: Pure Aluminum

Thickness: 10

PASSIVATION:

Type: PSG/Nitride

PSG: 7

Nitride: 8

PROCESS:

CMOS Metal Gate

Metallization Mask Layout

AD7545

PIN 3

DGND

PIN 2

AGND

PIN 1

OUT1

PIN 20

PIN 19

PIN 17

WR

PIN 16

PIN 15

PIN 14

PIN 4

DB11

(MSB)

PIN 5

DB10

PIN 6

DB9

PIN 7

DB8

PIN 12

DB3

PIN 10

DB5

PIN 9

DB6

PIN 8

DB7

PIN 18

CS

DB0

(LSB)

DB1

PIN 13

DB2

PIN 11

DB4

AD7545

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