SM6TY

Characteristics

Doc ID 17741 Rev 3

7/12

Figure 10.

Junction capacitance versus reverse

applied voltage for unidirectional

types (typical values)

Figure 11.

Junction capacitance versus

reverse applied voltage for

bidirectional types (typical values)

C(pF)

10

100

1000

10000

1

10

100

1000

SM6T6V8AY

SM6T30AY

SM6T82AY

F = 1 Mhz

V

= 30 mV

T = 25 °C

OSC

RMS

j

V (V)

R

100

1000

10000

1

10

100

1000

C(pF)

SM6T6V8CAY

SM6T30CAY

SM6T82CAY

F = 1 Mhz

V

= 30 mV

T = 25 °C

OSC

RMS

j

V (V)

R

Figure 12.

Relative variation of thermal

impedance, junction to ambient,

versus pulse duration

Figure 13.

Thermal resistance junction to

ambient versus copper surface

under each lead

Zth (j-a)/Rth (j-a)

0.01

0.10

1.00

1.0E-03

1.0E-02

1.0E-01

1.0E+00

1.0E+01

1.0E+02

1.0E+03

Recommended pad layout

Printed circuit board FR4, copper thickness = 35 µm

s

tp

R

0

10

20

30

40

50

60

70

80

90

100

110

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

Printed circuit board FR4,

copper thickness = 35 µm

Figure 14.

Leakage current versus junction

temperature (typical values)

Figure 15.

Peak forward voltage drop versus

peak forward current

(typical values)

I

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

25

50

75

100

125

150

V

V

V

V

T (° C)

j

1.0E-02

1.0E-01

1.0E+00

1.0E+01

1.0E+02

0.0

0.5

1.0

1.5

2.0

2.5

3.0

I

T

T