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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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AD5305ARM датащи(PDF) 5 Page - Analog Devices |
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AD5305ARM датащи(HTML) 5 Page - Analog Devices |
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5 / 24 page  AD5305/AD5315/AD5325 Rev. G | Page 5 of 24 AC CHARACTERISTICS VDD = 2.5 V to 5.5 V, RL = 2 kΩ to GND, CL = 200 pF to GND, all specifications TMIN to TMAX, unless otherwise noted. Table 2. A, B Version1 Parameter2, 3 Min Typ Max Unit Conditions/Comments Output Voltage Settling Time VREF = VDD = 5 V AD5305 6 8 μs ¼ scale to ¾ scale change (0×40 to 0×C0) AD5315 7 9 μs ¼ scale to ¾ scale change (0×100 to 0×300) AD5325 8 10 μs ¼ scale to ¾ scale change (0×400 to 0×C00) Slew Rate 0.7 V/μs Major-Code Transition Glitch Energy 12 nV-s 1 LSB change around major carry Digital Feedthrough 1 nV-s Digital Crosstalk 1 nV-s DAC-to-DAC Crosstalk 3 nV-s Multiplying Bandwidth 200 kHz VREF = 2 V ± 0.1 V p-p Total Harmonic Distortion −70 dB VREF = 2.5 V ± 0.1 V p-p, frequency = 10 kHz 1 Temperature range (A, B version): −40°C to +105°C; typical at +25°C. 2 Guaranteed by design and characterization, not production tested. 3 See the Terminology section. TIMING CHARACTERISTICS VDD = 2.5 V to 5.5 V, all specifications TMIN to TMAX, unless otherwise noted. Table 3. Parameter1, 2 Limit at TMIN, TMAX (A, B Version) Unit Conditions/Comments fSCL 400 kHz max SCL clock frequency t1 2.5 μs min SCL cycle time t2 0.6 μs min tHIGH, SCL high time t3 1.3 μs min tLOW, SCL low time t4 0.6 μs min tHD,STA, start/repeated start condition hold time t5 100 ns min tSU,DAT, data setup time t63 0.9 μs max tHD,DAT, data hold time 0 μs min tHD,DAT, data hold time t7 0.6 μs min tSU,STA, setup time for repeated start t8 0.6 μs min tSU,STO, stop condition setup time t9 1.3 μs min tBUF, bus-free time between a stop and a start condition t10 300 ns max tR, rise time of SCL and SDA when receiving 0 ns min tR, rise time of SCL and SDA when receiving (CMOS compatible) t11 250 ns max tF, fall time of SDA when transmitting 0 ns min tF, fall time of SDA when receiving (CMOS compatible) 300 ns max tF, fall time of SCL and SDA when receiving 20 + 0.1 CB4 ns min tF, fall time of SCL and SDA when transmitting CB4 400 pF max Capacitive load for each bus line 1 See Figure 2. 2 Guaranteed by design and characterization; not production tested. 3 A master device must provide a hold time of at least 300 ns for the SDA signal (referred to VIH min of the SCL signal) in order to bridge the undefined region of SCL’s falling edge. 4 CB is the total capacitance of one bus line in pF. tR and tF measured between 0.3 VDD and 0.7 VDD. |
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