DocID4578 Rev 24

33/42

M24C32-W M24C32-R M24C32-F M24C32-X M24C32-DF

Package mechanical data

41

9

Package mechanical data

In order to meet environmental requirements, ST offers these devices in different grades of

For die information concerning the M24C32 delivered in unsawn wafer, please contact your

nearest ST Sales Office.

Figure 15. UFDFPN5 (MLP5) – package outline (UFDFPN: Ultra thin Fine pitch

Dual Flat Package, No lead)

1. On the bottom side, pin 1 is identified by the specific pad shape and, on the top side, pin 1 is defined from

the orientation of the marking: when reading the marking, pin 1 is below the upper left package corner.

Table 20. UFDFPN5 (MLP5) – package dimensions (UFDFPN: Ultra thin Fine pitch

Dual Flat Package, No lead)

Symbol

millimeters

1. Values in inches are converted from mm and rounded to four decimal digits.

Typ

Min

Max

Typ

Min

Max

A

0.550

0.500

0.600

0.0217

0.0197

0.0236

A1

–

0

0.050

–

0

0.0020

b

0.220

0.180

0.260

0.0087

0.0071

0.0102

D

1.700

1.600

1.800

0.0669

0.0630

0.0709

D1

1.500

1.400

1.600

0.0591

0.0551

0.0630

E

1.400

1.300

1.500

0.0551

0.0512

0.0591

E1

0.220

0.180

0.260

0.0087

0.0071

0.0102

e

0.400

–

–

0.0157

–

–

L

0.550

0.500

0.600

0.0217

0.0197

0.0236

k

0.400

–

–

0.0157

–

–