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ICS1572 датащи(PDF) 17 Page - Integrated Circuit Systems |
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ICS1572 датащи(HTML) 17 Page - Integrated Circuit Systems |
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17 / 19 page ![]() Output Circuitry The dot clock signals CLK and CLK- are typically the highest frequency signals present in the workstation. To minimize problems with EMI, crosstalk, and capacitive loading extra care should be taken in laying out this area of the PC board. The ICS1572 is packaged in a 0.3”-wide 20-pin SOIC package. This permits the clock generator, crystal, and related compo- nents to be laid out in an area the size of a postage stamp. The ICS1572 should be placed as close as possible to the RAM- DAC. The CLK and CLK- pins are running at VHF frequen- cies; one should minimize the length of PCB trace connecting them to the RAMDAC so that they don’t become radiators of RF energy. At the frequencies that the ICS1572 is capable of, PC board traces may be long enough to be a significant portion of a wavelength of that frequency. PC traces for CLK and CLK- should be treated as transmission lines, not just interconnecting wires. These lines can take two forms: microstrip and stripline. A microstrip line is shown below: Essentially, the microstrip is a copper trace on a PCB over a ground plane. Typically, the dielectric is G10 glass epoxy. It differs from a standard PCB trace in that its width is calculated to have a characteristic impedance. To calculate the charac- teristic impedance of a microstrip line one must know the width and thickness of the trace, and the thickness and dielectric constant of the dielectric. For G10 glass epoxy, the dielectric constant (er) is about 5. Propagation delay is strictly a function of dielectric constant. For G10 propagation, delay is calculated to be 1.77 ns/ft. Stripline is the other form a PCB transmission line can take. A buried trace between ground planes (or between a power plane and a ground plane) is common in multi-layer boards. Attempting to create a workstation design without the use of multi-layer boards would be adventurous to say the least, the issue would more likely be whether to place the interconnect on the surface or between layers. The between layer approach would work better from an EMI standpoint, but would be more difficult to lay out. A stripline is shown below: Using 1oz. copper (0.0015” thick) and 0.040” thickness G10, a 0.010” trace will exhibit a characteristic impedance of 75 Ω in a stripline configuration. Typically, RAMDACS require a Vih of VAA-1.0 Volts as a guaranteed logical “1” and a Vil of VAA-1.6 as a guaranteed logical “0.” Worst case input capacitance is 10 pF. Output circuitry for the ICS1572 is shown in the following diagram. It consists of a 4/1 current mirror, and two open drain output FETs along with inverting buffers to alternately enable each current-sinking driver. Both CLK and CLK- outputs are connected to the respective CLOCK and CLOCK* inputs of the RAMDAC with transmission lines and terminated in their equivalent impedances by the Thevenin equivalent impedances of R1 and R2 or R1’ and R2’. ICS1572 Application Information Output Circuit Considerations for the ICS1572 17 |
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