PS9601, PS9601L

7

PRECAUTIONS IN MOUNTING THE DEVICE

(1) Precautions in mounting the device by infrared reflow soldering

•

Peak reflow temperature

: 235 ˚C or below (Plastic surface temperature)

•

Reflow time

: 30 seconds or less (Time period during which the plastic surface temperature

is 210 ˚C)

•

Number of reflow processes: One

•

Flux

: Rosin flux containing small amount of chlorine (The flux with a maximum

chlorine content of 0.2 Wt% is recommended.)

INFRARED RAY REFLOW TEMPERATURE PROFILE

Times (s)

120 to 160 ˚C

60 to 90 s

(Pre-heat)

to 30 s

210 ˚C

235 ˚C Peak

(Actual heat)

to 10 s

Peak Temperature 230 ˚C

or Lower

(2) Precautions in mounting the device in solder dip method

•

Temperature

: 260 ˚C or lower

•

Time

: 10 sec. or less

•

Flux

: Rosin group flux, where the amount of chloride component is small.