1-250

Maximum Solder Reflow Thermal Profile

Regulatory Information

The HCPL-7840 has been

approved by the following

organizations:

UL Recognized under UL 1577,

Component Recognition

Program, File E55361.

CSA Approved under CSA

Component Acceptance Notice

#5, File CA 88324.

240

∆T = 115°C, 0.3°C/SEC

0

∆T = 100°C, 1.5°C/SEC

∆T = 145°C, 1°C/SEC

TIME – MINUTES

220

200

180

160

140

120

100

80

60

40

20

0

260

12

3

456789

10

11

12

(NOTE: USE OF NON-CHLORINE ACTIVATED FLUXES IS RECOMMENDED.)

Insulation and Safety Related Specifications

Parameter

Symbol

Value

Units

Conditions

Min. External Air Gap

L(IO1)

7.1

mm

Measured from input terminals to output

(External Clearance)

terminals, shortest distance through air.

Min. External Tracking Path

L(IO2)

7.4

mm

Measured from input terminals to output

(External Creepage)

terminals, shortest distance path along body.

Min. Internal Plastic Gap

0.08

mm

Through insulation distance, conductor to

(Internal Clearance)

conductor, usually the direct distance

between the photoemitter and photodetector

inside the optocoupler cavity.

Tracking Resistance

CTI

200

Volts

DIN IEC 112/VDE 0303 Part 1

(Comparative Tracking Index)

Isolation Group

IIIa

Material Group (DIN VDE 0110, 1/89, Table 1)

Option 300 - surface mount classification is Class A in accordance with CECC 00802.

Absolute Maximum Ratings

Parameter

Symbol

Min.

Max.

Unit

Note

Storage Temperature

-55

125

°C

Ambient Operating Temperature

-40

85

°C

Supply Voltages

0.0

5.5

V

Steady-State Input Voltage

-2.0

V

1

2 Second Transient Input Voltage

-6.0

Output Voltages

-0.5

V

Lead Solder Temperature

260

°C

(10 sec., 1.6 mm below seating plane)

Solder Reflow Temperature Profile

See Maximum Solder Reflow Thermal Profile Section