Pad Assignment

Chip size: 129 ´ 120 (mil)

2

* The IC substrate should be connected to VDD in the PCB layout artwork.

Pad Coordinates

Unit: mil

Pin No.

X

Y

Pin No.

X

Y

1

-58.61

18.57

18

58.82

0.51

2

-58.61

6.16

19

58.82

8.24

3

-58.61

-1.49

20

58.82

15.90

4

-58.61

-13.30

21

58.82

23.63

5

-58.61

-20.95

22

58.82

31.28

6

-58.61

-33.02

23

58.82

39.01

7

-58.61

-40.08

24

58.82

46.67

8

-57.25

-53.63

25

46.24

54.06

9

-50.62

-53.63

26

38.59

54.06

10

-43.99

-53.63

27

31.96

54.06

11

-37.36

-53.63

28

24.82

54.06

12

-15.64

-53.34

29

7.39

54.06

13

-3.19

-53.34

30

-0.43

53.29

14

7.44

-52.66

31

-14.28

53.29

15

26.05

-52.66

32

-23.63

53.29

16

58.48

-48.75

33

-42.33

53.29

17

58.82

-7.14

HT7500

2

August 8, 2000

1

18

2

19

3

20

4

21

5

22

6

23

7

24

8

25

9

26

10

27

11

28

12

29

13

30

14

31

15

32

16

33

17

LO W C

VS S

SC

RF

RS

VD D

PS W

SA 1

SA 2

SA 3

SB 1

SB 2

SB 3

SC 1

SC 2

(0 , 0 )