30CPQ080 datasheet(3/5 Pages) SMC

3 / 5 page

SANGDEST

MICROELECTRONICS

Technical Data

Green Products

Data Sheet N0679, Rev. -

• Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113

(86) 25-87123907

•

• FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn •

30CPQ080

30CPQ100

Electrical Characteristics:

Characteristics

Symbol

Condition

Max.

Units

VF1

@ 15A, Pulse, TJ = 25 °C

@ 30A, Pulse, TJ = 25 °C

0.86

1.05

Max. Forward Voltage Drop

(per leg) *

VF2

@ 15A, Pulse, TJ = 125 °C

@ 30A, Pulse, TJ = 125 °C

0.67

0.81

Max. Reverse Current (per

leg) *

IR1

@VR = rated VR

TJ = 25 °C

0.55

IR2

@VR = rated VR

TJ = 125 °C

7.0

Max. Junction Capacitance

(per leg)

@VR = 5V, TC = 25 °C

fSIG = 1MHz

500

Typical Series Inductance

(per leg)

Measured lead to lead 5 mm

from package body

7.5

Max. Voltage Rate of Change

dv/dt

10,000

μs

* Pulse Width < 300µs, Duty Cycle <2%

Thermal-Mechanical Specifications:

Characteristics

Symbol

Condition

Specification

Units

Max. Junction Temperature

-55 to +175

°C

Max. Storage Temperature

Tstg

-55 to +175

°C

2.2(peg leg)

Maximum Thermal

Resistance Junction to Case

(per leg)

RθJC

DC operation

1.10(peg device)

°C/W

Typical Thermal Resistance,

case to Heat Sink

Rθcs

Mounting surface, smooth and

greased

0.24

°C/W

Approximate Weight

6.7

Case Style

TO-247AD

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