Pad Assignment

Pad Coordinates

Unit: mil

Pad

No.

XY

Pad

No.

XY

1

-62.7 58.7

16

27.3 -58.7

2

-62.7 48.7

17

37.3 -58.7

3

-62.7 30.1

18

47.3 -58.7

4

-62.7 17.2

19

58.3 -58.7

5

-62.7 7.3

20

62.7 -38.8

6

-62.7 -18.7

21

62.7 -23.7

7

-62.7 -58.7

22

62.7 48.6

8

-52.7 -58.7

23

62.7 58.7

9

-42.7 -58.7

24

43.8 58.7

10

-32.7 -58.7

25

33.8 58.7

11

-22.7 -58.7

26

5.8

58.7

12

-12.7 -58.7

27

-4.3 58.7

13

-2.7 -58.7

28

-38.6 58.7

14

7.3 -58.7

29

-48.6 58.7

15

17.3 -58.7

Chip size: 119 ´ 112 (mil)

2

* The IC substrate should be connected to VDD in the PCB layout artwork.

Operational Sequence

Note: S1 for Hour setting

S2 for Minute setting

S3 to Start/Stop the timer

S3>5 seconds into the real time setting mode

S1/S2 to reset the timer to the initial state (0:00)

S1/S2/S3 to return to the real time mode

HT1330

2

August 10, 2000

1

16

2

17

3

18

4

19

5

20

6

21

7

22

8

23

9

24

10

25

11

26

12

27

13

28

14

29

15

(0 , 0 )

S3

S2

S1

VE E

CA P 2

CA P 1

CO M 1

BU S Y

OS C 2

OS C 1

Po w e r o n

R eal T i m e S et t i ng

U p / D ow n T i m e r

S3

S3 > 5 s e c

S1 o r S 2

S3

S3

S1 / S 2

S1 / S 2 / S 3

S1 / S 2

S 1 / S 2 or S 1/ S 2 / S 3

S 1 / S 2 or S 1/ S 2 / S 3

C o unt - dow n T i m e r

R eal T i m e

C ount - up T i m e r

C ount - dow n

T i m e S e tti n g