UR5515

CMOS IC

UNISONICTECHNOLOGIESCO.,LTD

5 of 8

www.unisonic.com.tw

QW-R502-056,A

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TYPICAL APPLICATION CIRCUIT

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APPLICATIONS INFORMATION

this small footprint of PCB for plastic SOP-8 package is not enough to dissipate effectively the heat generated

when operating at high current levels. In order to control die operating temperatures, the PCB layout should allow

used to prevent overstepping maximum junction temperature. The recommended SMT is as below.

The PCB heat sink copper area should be

solder painted without masked. This

approaches a "best case " pad heat sink .

UTC UR5515

(SOP-8)

Use vias to conduct the heat into the

buried or backside of PCB layer.