TSL1401CS−LF

128 × 1 LINEAR SENSOR ARRAY WITH HOLD

TAOS072E − APRIL 2007

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Copyright E 2007, TAOS Inc.

The LUMENOLOGY r Company

www.taosinc.com

MANUFACTURING INFORMATION

This product, in the solder bump linear array package, has been tested and has demonstrated an ability to be

reflow soldered to a PCB substrate. The process, equipment, and materials used in these tests are detailed

below.

Tooling Required

Process

1. Apply solder paste using stencil

2. Dispense adhesive dots

3. Place component

4. Reflow solder/cure

5. X-Ray verify

Placement of the TSL1401CS−LF device onto the gold immersion substrate is accomplished using a standard

surface mount manufacturing process. First, using the stencil with 0.36 mm square aperture, print solder paste

onto the substrate. Next, dispense two 0.25 mm to 0.4 mm diameter dots of adhesive in opposing corners of

the TSL1401CS−LF mounting area. Machine place the TSL1401CS−LF from the JEDEC waffle carrier onto the

substrate. A suggested pick-up tool is the Siemens Vacuum Pickup tool nozzle number 912. This nozzle has

a rubber tip with a diameter of approximately 0.75 mm. The part is picked up from the center of the body. Reflow

the solder and cure the adhesive using the solder profile shown in Figure 14.

The reflow profiles specified here describe expected maximum heat exposure of components during the solder

reflow process of product on a PWB. Temperature is measured at the top of component. The components

should be limited to one pass through the solder reflow profile used.

Table 1. TSL1401CS−LF Solder Reflow Profile

PARAMETER

REFERENCE

TSL1401CS−LF

Average temperature gradient in preheating

2.5°C/sec

Soak time

2 to 3 minutes

Max 60 sec

Max 50 sec

Max 10 sec

Peak temperature in reflow

260°C (−0°C/+5°C)

Temperature gradient in cooling

Max −5°C/sec