TLV3691

SBOS694 – DECEMBER 2013

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the

device product folder at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

(1)

MIN

MAX

UNIT

Supply voltage

+7

V

(V–) – 0.5

(V+) + 0.5

V

Signal input terminals

±10

mA

continuous

mA

–55

+150

°C

Temperature

–65

+150

°C

+150

°C

Human body model (HBM)

2.5

kV

Electrostatic discharge (ESD)

ratings

Charged-device model (CDM)

1

kV

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and do not imply functional operation of the device at these or any other conditions. Exposure to absolute-maximum-rated

conditions for extended periods may affect device reliability.

(2)

Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails should

be current-limited to 10 mA or less.

(3)

Short-circuit to ground, one comparator per package.

THERMAL INFORMATION

TLV3691

DCK (SC70)

DPF (DFN)

UNITS

5 PINS

6 PINS

Junction-to-ambient thermal resistance

297.4

252.4

Junction-to-case (top) thermal resistance

109.3

93.9

Junction-to-board thermal resistance

74.4

192.8

°C/W

Junction-to-top characterization parameter

3.0

3.0

Junction-to-board characterization parameter

73.6

203.8

Junction-to-case (bottom) thermal resistance

N/A

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

Submit Documentation Feedback

Copyright © 2013, Texas Instruments Incorporated

Product Folder Links: TLV3691