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LP38841 датащи(PDF) 8 Page - Texas Instruments |
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LP38841 датащи(HTML) 8 Page - Texas Instruments |
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8 / 18 page ![]() LP38841 SNVS289B – DECEMBER 2004 – REVISED SEPTEMBER 2006 www.ti.com Figure 3. θJA vs Copper (1 Ounce) Area for TO-263 package As shown in the graph below, increasing the copper area beyond 1 square inch produces very little improvement. The minimum value for θJA for the TO-263 package mounted to a PCB is 32°C/W. Figure 4 shows the maximum allowable power dissipation for TO-263 packages for different ambient temperatures, assuming θJA is 35°C/W and the maximum junction temperature is 125°C. Figure 4. Maximum power dissipation vs ambient temperature for TO-263 package 8 Submit Documentation Feedback Copyright © 2004–2006, Texas Instruments Incorporated Product Folder Links: LP38841 |
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