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LM3501 датащи(PDF) 17 Page - Texas Instruments |
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LM3501 датащи(HTML) 17 Page - Texas Instruments |
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17 / 26 page ![]() ICL KD' IOUT VIND 2LFSW - | IOUT KD' IL(AVE) | IOUT KD' IPK VIND 2LFSW + | LM3501 www.ti.com SNVS230B – MAY 2004 – REVISED MAY 2005 Table 1. Typical Peak Inductor Current (mA)(1) (continued) LED Current VIN # LEDs 15 20 30 40 50 60 (V) (in series) mA mA mA mA mA mA 4.2 2 64 76 96 116 142 162 3 102 116 148 180 210 246 4 122 146 186 232 272 318 5 179 206 263 324 388 456 The typical cycle-by-cycle peak inductor current can be calculated from the following equation: (7) where IOUT is the total load current, FSW is the switching frequency, L is the inductance and η is the converter efficiency of the total driven load. A good typical number to use for η is 0.8. The value of η can vary with load and duty cycle. The average inductor current, which is also the average VSW pin current, is given by the following equation: (8) The maximum output current capability of the LM3501 can be estimated with the following equation: (9) where ICL is the current limit. Some recommended inductors include but are not limited to: Coilcraft DT1608C series Coilcraft DO1608C series TDK VLP4612 series TDK VLP5610 series TDK VLF4012A series CAPACITOR SELECTION Choose low ESR ceramic capacitors for the output to minimize output voltage ripple. Multilayer X7R or X5R type ceramic capacitors are the best choice. For most applications, a 1 µF ceramic output capacitor is sufficient. Local bypassing for the input is needed on the LM3501. Multilayer X7R or X5R ceramic capacitors with low ESR are a good choice for this as well. A 1 µF ceramic capacitor is sufficient for most applications. However, for some applications at least a 4.7 µF ceramic capacitor may be required for proper startup of the LM3501. Using capacitors with low ESR decreases input voltage ripple. For additional bypassing, a 100 nF ceramic capacitor can be used to shunt high frequency ripple on the input. Some recommended capacitors include but are not limited to: TDK C2012X7R1C105K Taiyo-Yuden EMK212BJ105 G LAYOUT CONSIDERATIONS The input bypass capacitor CIN, as shown in Figure 3, must be placed close to the device and connect between the VIN and GND pins. This will reduce copper trace resistance which effects the input voltage ripple of the IC. For additional input voltage filtering, a 100 nF bypass capacitor can be placed in parallel with CIN to shunt any high frequency noise to ground. The output capacitor, COUT, should also be placed close to the LM3501 and connected directly between the VOUT and GND pins. Any copper trace connections for the COUT capacitor can increase the series resistance, which directly effects output voltage ripple and efficiency. The current setting resistor, RLED, should be kept close to the FB pin to minimize copper trace connections that can inject noise into the system. The ground connection for the current setting resistor should connect directly to the GND pin. The Copyright © 2004–2005, Texas Instruments Incorporated Submit Documentation Feedback 17 Product Folder Links: LM3501 |
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