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LM3500 датащи(PDF) 2 Page - Texas Instruments

номер детали LM3500
подробное описание детали  Synchronous Step-up DC/DC Converter for White LED Applications
PDF  25 Pages
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производитель  TI1 [Texas Instruments]
домашняя страница  http://www.ti.com
Logo TI1 - Texas Instruments

LM3500 датащи(HTML) 2 Page - Texas Instruments

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A1
B1
C1
C2
C3
B3
A3
A2
GND
FB
VSW
VIN
SHDN
L
22 PH
LM3500-16
VOUT
AGND
A1
NC
C3
B1
C1
C2
B3
A2
A3
<0.3V
>1.1V
VIN
2.7V - 5.5V
R2
24:
COUT
1PF
Ceramic
CIN
1PF
Ceramic
LM3500
SNVS231F – MAY 2004 – REVISED APRIL 2007
www.ti.com
Typical Application Circuit
Connection Diagram
Top View
Figure 1. 8-bump micro SMD
Pin Description/Functions
Pin
Name
Function
A1
AGND
Analog ground.
B1
VIN
Analog and Power supply input.
C1
VOUT
PMOS source connection for synchronous rectification.
C2
VSW
Switch pin. Drain connections of both NMOS and PMOS power devices.
C3
GND
Power Ground.
B3
FB
Output voltage feedback connection.
A3
NC
No internal connection made to this pin.
A2
SHDN
Shutdown control pin.
AGND(pin A1): Analog ground pin. The analog ground pin should tie directly to the GND pin.
VIN(pin B1): Analog and Power supply pin. Bypass this pin with a capacitor, as close to the device as possible,
connected between the VIN and GND pins.
VOUT(pin C1): Source connection of internal PMOS power device. Connect the output capacitor between the
VOUT and GND pins as close as possible to the device.
VSW(pin C2): Drain connection of internal NMOS and PMOS switch devices. Keep the inductor connection close
to this pin to minimize EMI radiation.
GND(pin C3): Power ground pin. Tie directly to ground plane.
2
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Copyright © 2004–2007, Texas Instruments Incorporated
Product Folder Links: LM3500



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