FT240XQ-R datasheet(35/40 Pages) ETC2

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FT240X USB 8-BIT FIFO IC Datasheet

Version 1.3

Document No.: FT_000626 Clearance No.:

FTDI# 259

9.5 Solder Reflow Profile

The FT240X is supplied in Pb free 24 LD SSOP and QFN-24 packages. The recommended solder reflow

profile for both package options is shown in 9.5.

Figure 9.5 FT240X Solder Reflow Profile

The recommended values for the solder reflow profile are detailed in Table 9.1. Values are shown for both

a completely Pb free solder process (i.e. the FT240X is used with Pb free solder), and for a non-Pb free

solder process (i.e. the FT240X is used with non-Pb free solder).

Profile Feature

Pb Free Solder Process

Non-Pb Free Solder Process

Average Ramp Up Rate (Ts to Tp)

3°C / second Max.

3°C / Second Max.

Preheat

- Temperature Min (Ts Min.)

- Temperature Max (Ts Max.)

- Time (ts Min to ts Max)

150°C

200°C

60 to 120 seconds

100°C

150°C

60 to 120 seconds

Time Maintained Above Critical

Temperature TL:

- Temperature (TL)

- Time (tL)

217°C

60 to 150 seconds

183°C

60 to 150 seconds

Peak Temperature (Tp)

260°C

240°C

Time within 5°C of actual Peak

Temperature (tp)

20 to 40 seconds

Ramp Down Rate

6°C / second Max.

Time for T= 25°C to Peak Temperature,

8 minutes Max.

6 minutes Max.

Table 9.1 Reflow Profile Parameter Values

Critical Zone: when

T is in the range

T to T

Time, t (seconds)

T = 25º C to T

Preheat

Ramp Up

Ramp

Down

T Max

T Min

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