2

Internal Circuit Diagram

Parameter

Red

HDSP-4820

AlGaAs Red

HLCP-J100

HER

HDSP-4830

Yellow

HDSP-4840

Green

HDSP-4850

Average PowerDissipation per LED

63 mW

37 mW

87 mW

50 mW

105 mW

Peak Forward Current per LED

DC Forward Current per LED

Operating Temperature Range

-40°C to +85°C

-20°C to +100°C

-40°C to +85°C

-20°C to +85°C

Storage Temperature Range

-40°C to +85°C

-55°C to +100°C

-40°C to +85°C

Reverse Voltage per LED

3.0 V

5.0 V

3.0 V

Lead Solder Dipping Temperature

(1.59 mm (1/16 inch)

Wave Soldering Temperature

(at 2 mm distance from the body)

250°C for 3 seconds

Notes:

1. Absolute maximum ratings for HER, Yellow, and Green elements of the multicolor arrays are identical to the HDSP-4830/4840/4850 maximum

ratings.

2. See Figure 1 to establish pulsed operating conditions. Maximum pulse width is 1.5 ms.

3. See Figure 2 to establish pulsed operating conditions. Maximum pulse width is 1.5 ms.

4. See Figure 8 to establish pulsed operating conditions. Maximum pulse width is 2 ms.

mA/°C. See Figure 9.

7. Clean only in water, isopropanol, ethanol, Freon TF or TE (or equivalent), or Genesolve DI-15 (or equivalent).

8. Maximum tolerable component side temperature is 134°C during solder process.

120

a

10

11

j

219

318

417

516

615

714

813

912

b

c

d

e

f

g

h

i

Pin

Function

Pin

Function

1

Anode a

11

Cathode j

2

Anode b

12

Cathode I

3

Anode c

13

Cathode h

4

Anode d

14

Cathode g

5

Anode e

15

Cathode f

6

Anode f

16

Cathode e

7

Anode g

17

Cathode d

8

Anode h

18

Cathode c

9

Anode i

19

Cathode b

10

Anode j

20

Cathode a