AT45DB641E datasheet(2/72 Pages) ETC2

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AT45DB641E

DS-45DB641E-027E–DFLASH–1/2014

Description

The AT45DB641E is a 1.7V minimum, serial-interface sequential access Flash memory ideally suited for a wide variety of

digital voice, image, program code, and data storage applications. The AT45DB641E also supports the RapidS serial

interface for applications requiring very high speed operation. Its 69,206,016 bits of memory are organized as 32,768

pages of 256 bytes or 264 bytes each. In addition to the main memory, the AT45DB641E also contains two SRAM

buffers of 256/264 bytes each. Interleaving between both buffers can dramatically increase a system's ability to write a

continuous data stream. In addition, the SRAM buffers can be used as additional system scratch pad memory, and

E2PROM emulation (bit or byte alterability) can be easily handled with a self-contained three step read-modify-write

operation.

Unlike conventional Flash memories that are accessed randomly with multiple address lines and a parallel interface, the

DataFlash® uses a serial interface to sequentially access its data. The simple sequential access dramatically reduces

active pin count, facilitates simplified hardware layout, increases system reliability, minimizes switching noise, and

reduces package size. The device is optimized for use in many commercial and industrial applications where



high-density, low-pin count, low-voltage, and low-power are essential.

To allow for simple in-system re-programmability, the AT45DB641E does not require high input voltages for

programming. The device operates from a single 1.7V to 3.6V power supply for the erase and program and read

operations. The AT45DB641E is enabled through the Chip Select pin (CS) and accessed via a 3-wire interface consisting

of the Serial Input (SI), Serial Output (SO), and the Serial Clock (SCK).

All programming and erase cycles are self-timed.

Pin Configurations and Pinouts

Figure 1-1.

Pinouts

Note:

The metal pad on the bottom of the DFN package is not internally connected to a voltage potential.



This pad can be a “no connect” or connected to GND. Care must be taken to avoid the Metal Pad shorting

on PCB tracks.

SCK

RESET

GND

VCC

8-lead SOIC

Top View

SCK

RESET

GND

VCC

8-pad UDFN

Top View

SCK

GND

VCC

RST

8-ball UBGA

Top View

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