Surface Mount Plastic PIN Diodes

Rev. V19

SMPP Series

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MA-COM Technical Solutions and its affiliates reserve the right to make changes to the

product(s) or information contained herein without notice.

9

ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is

considering for development. Performance is based on target specifications, simulated results, and/

or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions

has under development. Performance is based on engineering tests. Specifications are typical.

Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commit-

ment to produce in volume is not guaranteed.

Mounting Information

The

illustration

indicates

the

recommended

mounting pad configuration for the SOT-23,

SOT-323 , SOD-323, SOT-143, and SC-79

packages. Solder paste containing flux should be

screened onto the pads to a thickness of 0.005-

0.007 inches. The plastic package is placed in

position, firmly adhering to the solder paste.

Permanent attachment is performed by a reflow

soldering

procedure

during

which

the

tab

temperature does not exceed +275

°C and the

body temperature does not exceed +250

°C, for

standard models and +260

°C for the RoHS

compliant devices.

Please refer to Application Note M538 for

surface mounting instructions.

SOT-323

0.030

0.80

0.030

0.80

0.030

0.80

0.075

1.9

0.030

0.80

inches

mm

Dimenstions:

0.030

0.80

.090

2.2

0.030

0.80

inches

mm

Dimenstions:

0.030

0.80

SOD-323/SC70

SOT-23

0.75

1.9

.0 3 7

0.9 5

.035

0.90

.0 9 0

2.2

.0 3 0

0.8 0

in ch es

mm

Dime n stion s:

min .

min .

SC-79

0.020

0.50

0.053

1.35

inches

mm

Dimenstions:

0.020

0.50

SOT-143

0.035

0.89

0.115

2.92

0.045

1.17

0.045

1.14

0.030

0.76

inches

mm

Dimenstions:

0.045

1.14

0.106

2.69

0.031

0.79